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Reliability Physics and Engineering: Time-To-Failure Modeling, by J. W. McPherson
Download PDF Reliability Physics and Engineering: Time-To-Failure Modeling, by J. W. McPherson
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This book provides critically important information for designing and building reliable cost-effective products. It includes numerous example problems with solutions.
- Sales Rank: #3942989 in Books
- Published on: 2015-07-09
- Released on: 2015-07-09
- Original language: English
- Number of items: 1
- Dimensions: 9.25" h x .94" w x 6.10" l, 1.28 pounds
- Binding: Paperback
- 399 pages
From the Back Cover
Reliability Physics and Engineering provides critically important information that is needed for designing and building reliable cost-effective products.
Key features include:
· Materials/Device Degradation
· Degradation Kinetics
· Time-To-Failure Modeling
· Statistical Tools
· Failure-Rate Modeling
· Accelerated Testing
· Ramp-To-Failure Testing
· Important Failure Mechanisms for Integrated Circuits
· Important Failure Mechanisms for Mechanical Components
· Conversion of Dynamic Stresses into Static Equivalents
· Small Design Changes Producing Major Reliability Improvements
· Screening Methods
· Heat Generation and Dissipation
· Sampling Plans and Confidence Intervals
This textbook includes numerous example problems with solutions. Also, exercise problems along with the answers are included at the end of each chapter.
Reliability Physics and Engineering can be a very useful resource for students, engineers, and materials scientists.
About the Author
Dr. J.W. McPherson is at McPherson Reliability Consulting, LLC.
Most helpful customer reviews
3 of 3 people found the following review helpful.
Reliability at Its Best
By Zoltan Ring
Author Joe W. McPherson received his Ph. D. degree in physics from Florida State University; and he has been with Texas Instruments since 1980. He is now Texas Instruments Senior Fellow Emeritus. He has 150 publications in the field of semiconductor reliability. He applies science to reliability problems to solve them.
Throughout the book, the author tries to give examples for reliability issues for pipes, tires, turbine blades, but without question, the primary thrust of the book is semiconductor reliability. The chapters deal with device degradation and fitting degradation data; statistics (Normal, Lognormal and Weibull distribution); failure rate; accelerated degradation and modeling, ramp to failure test, and TTF models for semiconductor circuits (this being the condensed version of Dr. McPherson's work), mechanical reliability issues and conversion of dynamic stress into static equivalent.
There are plenty of examples (with realistic experimental data) in each chapter to illustrate how to fit data, how to construct the statistics and calculate statistical variables; how to accelerate degradation and to project to use conditions for exponential and power law models; analytical formulas for ramp testing establishing effective time at fail stress level for exponential and power law models. TTF models for semiconductor circuits chapter include electron and stress migration and their relation to grain boundaries and conductor geometries; corrosion and exponential corrosion model with RH%; thermal cycling and associated crack propagation - plastic deformation and corresponding Cofin-Manson model; Time-Dependent Dielectric Breakdown (TDDB) - E, 1/E and 1/SQRT(E) models are discussed and compared for lifetime projections; Mobile Surface Inversion, Hot Carrier Injection and Negative Bias Instability are also discussed. Mechanical reliability issues - most with semiconductor reliability issues in mind - are discussed in a separate chapter: bonds and Mie-Gruneisen potential, ionic bonds, elastic and inelastic behavior of metals, grain boundaries, fracture strength, creep and fatigue.
The book has a laser focus and clarity and does not degenerate into abstract academic discussions other than what is necessary for understanding issues at hand. The reader can follow up with the references and McPherson's publications - which have the same clarity and notation system that the book does. I highly recommend the book especially for those with a generic engineering background who deal with reliability - for them the book is going to be an eye opener.
1 of 1 people found the following review helpful.
The second edition has great color illustrations
By matt ring
The second edition has great color illustrations. This is a no-nonsense presentation of Reliabilty Physiscs, Statistical Distributions, etc. I would only wish for a more in-depth analysis of how to use Weibull or Log-normal distributions to for area scaling, and detailed comparisons of different wear-out distributions. It is an excellent text.
3 of 3 people found the following review helpful.
Martin review JW McPherson
By Colin A. Martin
This is an excellent Reliability Student's textbook with plenty of examples throughput the book and problems with answers at the end of each chapter. It is also an excellent reference book for the Reliability Professional with all the necessary equations, explanations, failure mechanisms and citations. I will be constantly referring to this book in my daily work as a Reliability Engineer.
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